LMC7101 datasheet(2/32 Pages) MICROCHIP

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LMC7101

DS20006282A-page 2

 2019 Microchip Technology Inc.

1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings † ††

Supply Voltage, (VV+ – VV–) ..................................................................................................................................... +15V

Differential Input Voltage, (VIN+ – VIN–)........................................................................................................ ±(VV+ – VV–)

I/O Pin Voltage, (VIN, VOUT) (Note 1) ........................................................................................VV+ + 0.3V to VV– – 0.3V

ESD Protection, (Note 2).................................................................................................................................±2 kV HBM

Operating Ratings††

Supply Voltage, VIN – VV– ..............................................................................................................................2.7V to 12V

Max. Power Dissipation........................................................................................................................................(Note 3)

† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.

This is a stress rating only and functional operation of the device at those or any other conditions above those indicated

in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended

periods may affect device reliability.

†† Notice: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical

specifications do not apply when operating the device outside its recommended operating ratings.

Note 1: I/O pin voltage is any external voltage to which an input or output is referenced.

2: Human body model, 1.5 kΩ in series with 100 pF.

3: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(max); the

junction-to-ambient thermal resistance, θJA; and the ambient temperature, TA. The maximum allowable

power dissipation at any ambient temperature is calculated using: PD = (TJ(max) – TA) ÷ θJA. Exceeding the

maximum allowable power dissipation will result in excessive die temperature.

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