MAXM17225 datasheet(2/14 Pages) MAXIM

2 / 14 page

Tiny, 0.4V to 5.5V Input, 300nA IQ, nanoPower

Boost Module with True Shutdown

MAXM17225

www.maximintegrated.com

Maxim Integrated | 2

Absolute Maximum Ratings

IN, INS, EN, OUT, RSEL to GND .......................... -0.3V to +6V

LX to GND ................................................ -0.3V to VOUT +0.3V

Continuous Power Dissipation (TA = +70°C).............................

eMGA (derate 9.72 mW/°C above 70°C)................. 777.91mW

Operating Temperature Range........................-

40˚C to +125˚C

Maximum Junction Temperature ...................................

+150˚C

Storage Temperature Range...........................-

65˚C to +150˚C

Lead Temperature (soldering, 10 seconds) ..................

+300˚C

Soldering Temperature (reflow).....................................

+260˚C

Note 1:

LX pin has internal clamps to GND and OUT. These diodes may be forward biased during switching transitions.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or

any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Information

10 eMGA

Package Code

M102A2+3

Outline Number

21-100245*

Land Pattern Number

90-100084*

Thermal Resistance, Four Layer Board:

Junction to

Ambient (θJA)

102.84 ºC/W

Junction to Case Thermal

Resistance (θJC)

15.04 ºC/W

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note

that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix

character, but the drawing pertains to the package regardless of RoHS status.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-

tutorial.

Electrical Characteristics

(VIN = VINS = VEN = 1.5V, VOUT = 3.0V, TA = -40°C to +125°C, CIN = COUT = 1x10µF, unless otherwise specified, see Note 2. )

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Minimum Input Voltage

VIN_MIN

Runs from output after startup, IOUT =

1mA

400

Input Voltage Range

VIN

Guaranteed by LX max On-time

0.95

5.5

Minimum Startup Input

Voltage

VIN_STARTUP

RL ≥ 3kΩ, Typical Operating Circuit, TA =

25°C

0.88

0.95

Output Voltage Range

VOUT

See

RSEL Selection Table. For VIN <

VOUT target. Note 3

1.8

Output Accuracy, LPM

ACCLPM

VOUT falling when LX switching

frequency is > 1MHz. Note 4

-1.5

1.5

Output Accuracy,

Ultra-Low-Power Mode

ACCULPM

VOUT falling when LX switching

frequency is > 1kHz. Note 5

2.5

Output Current

IOUT

VIN = 1.8V, VOUT = 3.3V

See IOUT vs. VIN curves in TOC section

200

Efficiency

VIN = 1.8V, VOUT = 3.3V, IOUT = 100μA

VIN = 1.8V, VOUT = 3.3V, IOUT = 50mA

Quiescent Supply

Current into OUT

IQ_OUT

VEN = VIN, Not

switching, VOUT =

104% of 1.8V

TA = 25°C

300

600

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