SMTY18AM datasheet(3/6 Pages) STMICROELECTRONICS

3 / 6 page

SMTY18AM

3/6

Figure 1: Peak pulse power versus exponential

pulse duration

Figure 2: Relative variation of peak pulse

power versus initial junction temperature

Figure 3: Average power dissipation versus

ambient temperature

Figure 4: Variation of thermal impedance

junction to ambient versus pulse duration

(Epoxy FR4, ecu=35µm)

Figure 5: Thermal resistance junction to

ambient versus copper surface under tab

Figure 6: Reverse leakage current versus

junction temperature (typical values)

100

1000

0.01

0.10

1.00

10.00

tp(ms)

j initial = 25°C

P(W)

100

110

100

125

150

175

Tj(°C)

0.0

0.1

0.2

0.3

0.4

0.5

100

125

150

Tamb(°C)

Printed circuit board FR4 (e

CU=35µm)

µ,

recommended pad layout

P(W)

0.1

1.0

10.0

100.0

1000.0

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

tp(s)

CU=0.135cm²

CU=2cm²

Zth(j-a)(°C/W)

100

150

200

250

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

SCU(cm²)

Rth(j-a)(°C/W)

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

1.E+05

100

125

150

Tj(°C)

R=VRM

I (µA)

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