SLIC Products

17

PHYSICAL DIMENSION

PL032

REVISION SUMMARY

Revision A to B

•

Minor changes were made to the data sheet style and format to conform to AMD standards.

Revision B to Revision C

•

In the Pin Description table, inserted/changed TP pin description to: “Thermal pin. Connection for heat dissipa-

tion. Internally connected to substrate (QBAT). Leave as open circuit or connected to QBAT. In both cases, the

TP pins can connect to an area of copper on the board to enhance heat dissipation.”

Revision C to Revision D

•

Deleted information on the Ceramic DIP and Plastic DIP packages.

•

The PL032 package was added to the new Physical Dimension section.

•

Updated the Pin Description table to correct inconsistencies.

.050 REF.

.026

.032

TOP VIEW

Pin 1 I.D.

.485

.495

.447

.453

.585

.595

.547

.553

16-038FPO-5

PL 032

DA79

6-28-94 ae

SIDE VIEW

SEATING

PLANE

.125

.140

.009

.015

.080

.095

.042

.056

.013

.021

.400

REF.

.490

.530