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DS8024-RJX+ 数据表(PDF) 2 Page - Maxim Integrated Products

部件名 DS8024-RJX+
功能描述  Smart Card Interface
PDF  15 Pages
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制造商  MAXIM [Maxim Integrated Products]
网页  https://www.maximintegrated.com/en.html
标志 MAXIM - Maxim Integrated Products

DS8024-RJX+ 数据表(HTML) 2 Page - Maxim Integrated Products

  DS8024-RJX+ Datasheet HTML 1Page - Maxim Integrated Products DS8024-RJX+ Datasheet HTML 2Page - Maxim Integrated Products DS8024-RJX+ Datasheet HTML 3Page - Maxim Integrated Products DS8024-RJX+ Datasheet HTML 4Page - Maxim Integrated Products DS8024-RJX+ Datasheet HTML 5Page - Maxim Integrated Products DS8024-RJX+ Datasheet HTML 6Page - Maxim Integrated Products DS8024-RJX+ Datasheet HTML 7Page - Maxim Integrated Products DS8024-RJX+ Datasheet HTML 8Page - Maxim Integrated Products DS8024-RJX+ Datasheet HTML 9Page - Maxim Integrated Products Next Button
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DS8024
Smart Card Interface
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED DC OPERATING CONDITIONS
(VDD = +3.3V, VDDA = +5.0V, TA = +25°C, unless otherwise noted.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Voltage Range on VDD Relative to GND ...............-0.5V to +6.5V
Voltage Range on VDDA Relative to PGND ...........-0.5V to +6.5V
Voltage Range on CP1, CP2, and VUP
Relative to PGND...............................................-0.5V to +7.5V
Voltage Range on All Other Pins
Relative to GND......................................-0.5V to (VDD + 0.5V)
Maximum Junction Temperature .....................................+125°C
Continuous Power Dissipation (multilayer board, TA = +70°C)
TSSOP (derate 14mW/°C above +70°C) .................1117.3mW
SO (derate 16.7mW/°C above +70°C) .....................1355.9mW
Storage Temperature Range .............................-55°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY
Digital Supply Voltage
VDD
2.7
6.0
V
VCC = 5V, |ICC| < 80mA
4.0
6.0
Card Voltage-Generator Supply Voltage
VDDA
VCC = 5V, |ICC| < 30mA
3.0
6.0
V
VTH2
Threshold voltage (falling)
2.30
2.45
2.60
V
Reset Voltage Thresholds
VHYS2
Hysteresis
50
100
150
mV
CURRENT CONSUMPTION
Active VDD Current 5V Cards
(Including 80mA Draw from 5V Card)
IDD_50V
ICC = 80mA, fXTAL = 20MHz,
fCLK = 10MHz, VDDA = 5.0V
215
mA
Active VDD Current 5V Cards
(Current Consumed by DS8024 Only)
IDD_IC
ICC = 80mA, fXTAL = 20MHz,
fCLK = 10MHz, VDDA = 5.0V (Note 2)
135
mA
Active VDD Current 3V Cards
(Including 65mA Draw from 3V Card)
IDD_30V
ICC = 65mA, fXTAL = 20MHz,
fCLK = 10MHz, VDDA = 5.0V
100
mA
Active VDD Current 3V Cards
(Current Consumed by DS8024 Only)
IDD_IC
ICC = 65mA, fXTAL = 20MHz,
fCLK = 10MHz, VDDA = 5.0V (Note 2)
35
mA
Inactive-Mode Current
IDD
Card inactive
500
μA
CLOCK SOURCE
Crystal Frequency
fXTAL
External crystal
0
20
MHz
fXTAL1
0
20
MHz
VIL_XTAL1
Low-level input on XTAL1 (Note 3)
-0.3
0.3 x
VDD
XTAL1 Operating Conditions
VIH_XTAL1
High-level input on XTAL1 (Note 3)
0.7 x
VDD
VDD +
0.3
V
External Capacitance for Crystal
CXTAL1,
CXTAL2
(Note 3)
15
pF
Internal Oscillator
fINT
2.7
MHz
SHUTDOWN TEMPERATURE
Shutdown Temperature
TSD
(Note 3)
+150
°C



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