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PD70101 数据表(PDF) 7 Page - Microchip Technology

部件名 PD70101
功能描述  PoE IEEE짰 802.3af/at PD Controller
PDF  31 Pages
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制造商  MICROCHIP [Microchip Technology]
网页  http://www.microchip.com
标志 MICROCHIP - Microchip Technology

PD70101 数据表(HTML) 7 Page - Microchip Technology

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2.
Electrical Specifications
The following section describes the electrical specifications of the PD70101/PD70201 device.
2.1
Absolute Maximum Ratings
The following table lists the absolute maximum ratings of the PD70101/PD70201 device.
Table 2-1. Absolute Maximum Ratings
Parameter
Value
Units
VPP, RDET, VPN_OUT (with respect to VPN_IN)
–0.3 to 74
VDC
RREF, RCLASS (with respect to VPN_IN)
–0.3 to 6
V
PGOOD, AT_FLAG, VAUX (with respect to VPN_OUT)
–0.3 to 74
V
VCC (with respect to PGND)
–0.3 to 40
VDC
PG, SG (with respect to PGND)
–0.3 to 20
VDC
VL, VSN, VSP (with respect to PGND)
–0.3 to 6
V
VH (with respect to VCC)
–0.3 to VCC–6
VDC
All Other Pins (with respect to GND)
–0.3 to VL +0.3
VDC
ESD (HBM) Protection at all I/O pins1
±1
kV
Maximum Junction Temperature (TJMAX)
150
°C
Operational Ambient Temperature
–40 to 85
°C
Storage Temperature Range
–65 to 150
°C
Peak Package Solder Re-flow Temperature (40 seconds
maximum exposure), MSL3
260
°C
Note: 
1.
All pins except pin 2 (PGOOD) and pin 31 (VAUX). Pin 2 and 31 ESD Protection is ±150 V HBM.
Exceeding these ratings might cause damage to the device. All voltages are with respect to VPN_IN. Currents are
positive into, negative out of specified terminal. These are stress ratings only and functional operation of the device at
these or any other conditions beyond those indicated under Recommended Operating Conditions are not implied.
Exposure to Absolute Maximum Ratings for extended periods may affect device reliability.
2.2
Thermal Specifications
The following table lists the thermal specifications of the PD70101/PD70201 device.
Table 2-2. Thermal Properties
Symbol
Thermal Resistance
Min
Type
Max
Units
θJC
Junction to case
5
°C/W
θJP
Junction to pad
4
°C/W
θJA
Junction to ambient
23
°C/W
Note:  The θJx numbers assume no forced airflow. Junction temperature is calculated using
TJ = TA + (PD x θjA). In particular, θJA is a function of the PCB construction. The stated number above is for a four-
layer board in accordance with JESD-51 (JEDEC) with thermal vias.
PD70101 and PD70201
Electrical Specifications
© 2020 Microchip Technology Inc.
Datasheet
DS00003738A-page 7



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