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TC80310 数据表(PDF) 28 Page - NXP Semiconductors |
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TC80310 数据表(HTML) 28 Page - NXP Semiconductors |
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28 / 31 page ![]() 28 NXP Semiconductors 80310 6 Packaging 6.1 Die dimensions Notes 27. Both Signal and Power Grounds must be connected for correct operation. Pad Function Die coordinates (origin at center of die) X/ μm Y/ μm 1 PH2 2166 2158 2 PH1 2098 1217 3 BUS -1989 834 4 SIGNAL GROUND(27) -1989 0 5 B + A 1179 -840 6 EXC 1179 -1987 7 POWER GROUND(27) -367 -2631 PH1 6080 μm PH2 5050 μm Y Axis ORIGIN (0,0) X Axis 1 2 3 4 5 6 7 B + A EXC PGND SGND BUS SCALE = Approximately 20:1 |
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