Table of Contents

1 Ratings................................................................................................5

1.1 Thermal handling ratings........................................................... 5

1.2 Moisture handling ratings.......................................................... 5

1.3 ESD handling ratings................................................................. 5

1.4 Voltage and current operating ratings........................................6

2 General............................................................................................... 7

2.1 Nonswitching electrical specifications...................................... 7

2.1.1

DC electrical characteristics.........................................7

2.1.2

Supply current characteristics...................................... 11

2.1.3

EMC performance........................................................ 12

2.2 Switching specifications............................................................ 13

2.2.1

Control timing.............................................................. 13

2.2.2

FTM module timing..................................................... 14

2.3 Thermal specifications...............................................................14

2.3.1

Thermal operating requirements.................................. 14

2.3.2

Thermal characteristics.................................................15

3 Peripheral operating requirements and behaviors.............................. 16

3.1 UHV modules............................................................................ 16

3.1.1

LDO electrical characteristics...................................... 16

3.1.2

Programmable gain amplifier (PGA) electronic

characterizations...........................................................17

3.1.3

Communication and clamp controller (CNC)

electronic characterizations.......................................... 18

3.2 Core modules............................................................................. 19

3.2.1

SWD electricals ...........................................................19

3.3 Clock modules........................................................................... 20

3.3.1

External oscillator (OSC) and ICS characteristics....... 20

3.4 Memories and memory interfaces..............................................22

3.4.1

NVM specifications......................................................22

3.5 Analog........................................................................................23

3.5.1

IFR measurement conditions........................................23

3.5.2

ADC characteristics......................................................24

3.5.3

Analog comparator (ACMP) electricals.......................26

3.6 Communication interfaces......................................................... 26

3.6.1

Inter-Integrated Circuit Interface (I2C) timing............ 27

4 Dimensions.........................................................................................28

4.1 Obtaining package dimensions.................................................. 28

5 Pinout................................................................................................. 28

5.1 Signal multiplexing and pin assignments.................................. 28

5.2 Device pin assignment............................................................... 30

6 Ordering Parts.................................................................................... 31

6.1 Determining valid orderable parts............................................. 31

7 Part Identification...............................................................................31

7.1 Description.................................................................................31

7.2 Format........................................................................................31

7.3 Fields..........................................................................................32

7.4 Example..................................................................................... 32

8 Terminology and guidelines...............................................................32

8.1 Definition: Operating requirement.............................................32

8.2 Definition: Operating behavior..................................................33

8.3 Definition: Attribute.................................................................. 33

8.4 Definition: Rating...................................................................... 34

8.5 Result of exceeding a rating.......................................................34

8.6 Relationship between ratings and operating requirements........ 35

8.7 Guidelines for ratings and operating requirements....................35

8.8 Definition: Typical value........................................................... 35

8.9 Typical value conditions............................................................36

9 Revision history................................................................................. 37

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MWPR1516 16 KB Flash, Rev2, 1/2015.

Freescale Semiconductor, Inc.