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LP-MSM014 数据表(PDF) 1 Page - Shanghai Leiditech Electronic Technology Co., Ltd

部件名 LP-MSM014
功能描述  Polymer PTC Devices
PDF  1 Pages
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制造商  LEIDITECH [Shanghai Leiditech Electronic Technology Co., Ltd]
网页  http://www.leiditech.com
标志 LEIDITECH - Shanghai Leiditech Electronic Technology Co., Ltd

LP-MSM014 数据表(HTML) 1 Page - Shanghai Leiditech Electronic Technology Co., Ltd

  LP-MSM014 Datasheet HTML 1Page - Shanghai Leiditech Electronic Technology Co., Ltd  
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Features
Small size of 1812
Lead-free and compliant with the European Union RoHS Directive 2011/65/EU
Fast tripping resettable circuit protection
Surface mount packaging for automated assembly
Agency Recognition: UL、CSA、TUV
Product Dimensions (mm)
A
B
C
D
E
Part number
Max.
Max.
Max.
Min.
Min.
LP-MSM014
4.73
3.41
1.00
0.30
0.30
Part Marking System
Electrical Characteristics
IH
IT
Vmax
Imax
Ttrip
Pd typ
Rmin
R1max
Part number
(A)
(A)
(V)
(A)
Current(A)
Time(S)
(W)
(Ω)
(Ω)
LP-MSM014
0.14
0.34
60
10
1.5
0.15
1.0
1.50
6.00
IH=Hold current: maximum current at which the device will not trip at 25℃ still air.
IT=Trip current: minimum current at which the device will always trip at 25℃ still air.
Vmax=Maximum voltage device can withstand without damage at rated current.
Imax=Maximum fault current device can withstand without damage at rated voltage.
Ttrip=Maximum time to trip(s) at assigned current.
Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment.
Rmin=Minimum device resistance at 25℃ prior to tripping.
R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow.
Thermal Derating
Maximum ambient operating temperature(℃)
LP-MSM014
-40
-20
0
20
25
40
50
60
70
85
Hold Current (A)
0.23
0.20
0.18
0.16
0.14
0.12
0.11
0.10
0.07
0.05
Trip Current (A)
0.48
0.44
0.40
0.36
0.34
0.28
0.26
0.24
0.18
0.12
Solder Reflow Recommendations
B
B
A
Solder Pad Layouts
A
B
C
Part number
(mm)
(mm)
(mm)
LP-MSM014
3.45
1.78
3.15
* Recommended reflow methods: IR, Vapor phase, hot air oven.
* Devices can be cleaned using standard industry methods and
solvents.
Notes:
 If reflow temperatures exceed the recommended profile, devices
may not meet the performance requirements.
 Devices are not designed to be wave soldered to the bottom side
of the board.
Package Information
Tape & Reel: 2000pcs per reel.
Effectivity: Reference documents shall be the issue in effect on the
date of invitation for bid.
Caution: Operation beyond the rated voltage or current may result in
rupture electrical arcing or flame. Specifications are subject to
change without notice.
DOCUMENT:M20085
REV LETTER: D
PAGE NO: 1 OF1
REV DATE: 2014-1-2
PART NUMBER:
LP-MSM014
W
Product family
Current rating
Polymer
PTC Devices
Surface mount fuses


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