MIC33M350

DS20006348B-page 26

 2020-2021 Microchip Technology Inc.

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Y2

Contact Pad Spacing

Contact Pad Length (X7)

Contact Pad Width (X24)

Contact Pitch

X1

C1

0.30

3.00

MILLIMETERS

0.50 BSC

MIN

E

MAX

0.65

Exposed Pad Length

X4

1.41

Microchip Technology Drawing C04-3220 Rev A

NOM

24-Lead Plastic Quad Flat, No Lead Package (N6A) - 3x4.5 mm Body [QFN]

1

2

24

Y1

Contact Pad Length (X24)

0.80

Exposed Pad Width

Y4

0.40

Thermal Via Diameter

V

Thermal Via Pitch

EV

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

E

X3

C1

C2

EV

X4

X6

EV

Y6

Y2

X5

Y5

Y7

Y4

EV

8X ØV

SILK SCREEN

EV

Exposed Pad Width

X5

0.43

Exposed Pad Length

Y5

2.40

Terminal to Exposed Pad

X6

0.20

Terminal to Exposed Pad

Y6

0.50

X1

Y1

Contact Pad Spacing

C2

4.50

X3

Contact Pad Width

0.20

Terminal to Exposed Pad

Y7

0.20

Outer Features

Inner Features