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MSCSM170AM039CD3AG 数据表(PDF) 11 Page - Microchip Technology |
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MSCSM170AM039CD3AG 数据表(HTML) 11 Page - Microchip Technology |
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11 / 16 page ![]() 2. Package Specifications The following section shows the package specification of the MSCSM170AM039CD3AG device. 2.1 Package Outline The following figure shows the package outline drawing of the MSCSM170AM039CD3AG device. The dimensions in the following figure are in millimeters. Figure 2-1. Package Outline Drawing Note: See application note 1908—Mounting instructions for D3 and D4 power modules for more information. MSCSM170AM039CD3AG Package Specifications © 2021 Microchip Technology Inc. Datasheet DS00003968A-page 11 |
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