Data Sheet

ADP5303

Rev. B | Page 21 of 21

OUTLINE DIMENSIONS

A

B

C

0.660

0.600

0.540

1.690

1.650

1.610

1.910

1.870

1.830

1

2

3

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

END VIEW

0.360

0.320

0.280

1.00

REF

0.50

BSC

SEATING

PLANE

0.270

0.240

0.210

0.345

0.325

0.305

0.455

0.435

0.415

0.390

0.360

0.330

COPLANARITY

0.04

BALL A1

IDENTIFIER

Figure 44. 9-Ball Wafer Level Chip Scale Package [WLCSP]

1.65 mm × 1.87 mm Body

(CB-9-6)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADP5303ACBZ-1-R7

−40°C to +125°C

9-Ball Wafer Level Chip Scale Package [WLCSP]

CB-9-6

ADP5303ACBZ-2-R7

−40°C to +125°C

9-Ball Wafer Level Chip Scale Package [WLCSP]

CB-9-6

ADP5303ACBZ-3-R7

−40°C to +125°C

9-Ball Wafer Level Chip Scale Package [WLCSP]

CB-9-6

ADP5303-EVALZ

Evaluation Board

1

Z = RoHS Compliant Part.

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registered trademarks are the property of their respective owners.

D13444-0-3/19(B)