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AS5600L 数据表(PDF) 39 Page - ams AG |
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AS5600L 数据表(HTML) 39 Page - ams AG |
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39 / 48 page ![]() ams Datasheet Page 39 [v1-12] 2020-May-14 Document Feedback AS5600L − Package Drawings & Markings The Wafer Level Chip Scale Package has a dimension of 2.07mm x 2.63mm. Ball pitch is 500μm. The internal Hall elements are placed on a radius of 1 mm. The center of the internal Hall array is NOT in the center of the package as shown in the figure below. The center of the magnet must be placed over the center of the Hall sensor array. Figure 42: WL-CSP Package Outline Drawing Note(s): 1. Pin1=A1 2. ccc coplanarity 3. All dimensions are in μm Green RoHS |
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