Data Sheet

ADM7155

Rev. C | Page 23 of 24

OUTLINE DIMENSIONS

2.54

2.44

2.34

0.50

0.40

0.30

TOP VIEW

8

1

5

4

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.70

1.60

1.50

0.203 REF

0.20 MIN

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

PIN 1

INDICATOR

(R 0.20)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

3.10

3.00 SQ

2.90

Figure 66. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]

3 mm × 3 mm Body, Very Very Thin, Dual Lead

(CP-8-21)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MS-012-A A

1.27

0.40

1.75

1.35

2.29

2.29

0.356

0.457

4.00

3.90

3.80

6.20

6.00

5.80

5.00

4.90

4.80

0.10 MAX

0.05 NOM

3.81 REF

0.25

0.17

8°

0°

0.50

0.25

45°

COPLANARITY

0.10

1.04 REF

8

1

4

5

1.27 BSC

SEATING

PLANE

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

BOTTOM VIEW

TOP VIEW

0.51

0.31

1.65

1.25

Figure 67. 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP]

Narrow Body

(RD-8-1)

Dimensions shown in millimeters