Vesper Technologies Inc - Preliminary Version

Solder Reflow Profile

Figure 7: Solder reflow profile

Handling Instructions

Vesper’s piezoelectric MEMS microphones are very resistant to harsh environments

such as dust and moisture. However, to avoid mechanical damage to the

microphone, we recommend using appropriate handling procedures when manually

handling the parts or when using pick and place equipment. The following guidelines

will avoid damage:

• Do not apply a vacuum to the bottom side of the microphone. A vacuum pen

may be used with care on the top side only.

• Do not apply very high air pressure over the port hole.

• Do not insert any large particles or objects in the port hole. The microphone

is resistant to small particles per IP5x specification.

• Do not board wash or clean after the reflow process or expose the acoustic

port to harsh chemicals.