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CONSMP024-G 数据表(PDF) 4 Page - Linx Technologies |
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CONSMP024-G 数据表(HTML) 4 Page - Linx Technologies |
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4 / 6 page ![]() 4 Datasheet CONSMP024-G Packaging Information The CONSMP024-G connector is packaged in plastic trays of 100 pcs. Distribution channels may offer alternative packaging options. Reflow Solder Profile Figure 5 shows the time and temperature data for reflow soldering the connector to a PCB. 125°C 185°C 217°C 255°C 235°C 60 120 30 150 180 210 240 270 300 330 360 0 90 50 100 150 200 250 300 Recommended RoHS Profile Max RoHS Profile Recommended Non-RoHS Profile 180°C Time (Seconds) Figure 3. Recommended Reflow Solder Profile |
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