Data Sheet

HMC8413

Rev. 0 | Page 21 of 21

OUTLINE DIMENSIONS

1.70

1.60

1.50

0.30

0.25

0.20

TOP VIEW

SIDE VIEW

0.35

0.30

0.25

BOTTOM VIEW

PIN 1 INDEX

AREA

0.90

0.85

0.80

1.10

1.00

0.90

0.203 REF

0.05 MAX

0.02 NOM

1.30 REF

0.65

BSC

EXPOSED

PAD

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

2.05

2.00 SQ

1.95

5

8

1

4

COPLANARITY

0.08

SEATING

PLANE

PIN 1

IN D ICATO R AR E A OP TIO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 76. 6-Lead Lead Frame Chip Scale Package [LFCSP]

2 mm × 2 mm Body and 0.85 mm Package Height

(CP-6-12)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Option

HMC8413LP2FE

−40°C to +85°C

MSL1

6-Lead Lead Frame Chip Scale Package [LFCSP]

CP-6-12

HMC8413LP2FETR

−40°C to +85°C

MSL1

6-Lead Lead Frame Chip Scale Package [LFCSP]

CP-6-12

EV1HMC8413LP2F

Evaluation Board

1

The HMC8413LP2FE, HMC8413LP2FETR, and EV1HMC8413LP2F are RoHS compliant parts.

2

When ordering the evaluation board only, reference the model number, EV1HMC8413LP2F.

3

See the Absolute Maximum Ratings for additional information.

4

The lead finish of the HMC8413LP2FE and HMC8413LP2FETR is nickel palladium gold (NiPdAu).

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D23879-10/21(0)