NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271)

.

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

EXAMPLE BOARD LAYOUT

4226135/A 08/2020

www.ti.com

WQFN - 0.8 mm max height

BQB0016B

INDSTNAME

SYMM

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 20X

(1)

(2)

16X (0.6)

16X (0.25)

2X (0.5)

10X (0.5)

(2.3)

(3.3)

2X (0.75)

1

16

2

7

8

9

10

15

17

(Ø 0.2) VIA

TYP

(R0.05) TYP