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TLV9001UIDBVR 数据表(PDF) 42 Page - Texas Instruments

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部件名 TLV9001UIDBVR
功能描述  TLV900x Low-Power, RRIO, 1-MHz Operational Amplifier for Cost-Sensitive Systems
PDF  94 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

TLV9001UIDBVR 数据表(HTML) 42 Page - Texas Instruments

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Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TLV9002SIYCKR
DSBGA
YCK
9
3000
180.0
8.4
1.1
1.1
0.4
2.0
8.0
Q1
TLV9004IDR
SOIC
D
14
2500
330.0
15.4
6.4
5.2
2.1
8.0
12.0
Q1
TLV9004IDR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
TLV9004IDYYR
SOT-
23-THIN
DYY
14
3000
330.0
12.4
4.8
3.6
1.6
8.0
12.0
Q3
TLV9004IPWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
TLV9004IRTER
WQFN
RTE
16
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
TLV9004IRUCR
QFN
RUC
14
3000
180.0
9.5
2.16
2.16
0.5
4.0
8.0
Q2
TLV9004SIRTER
WQFN
RTE
16
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLV9001IDBVR
SOT-23
DBV
5
3000
210.0
185.0
35.0
TLV9001IDCKR
SC70
DCK
5
3000
190.0
190.0
30.0
TLV9001IDPWR
X2SON
DPW
5
3000
205.0
200.0
33.0
TLV9001SIDBVR
SOT-23
DBV
6
3000
210.0
185.0
35.0
TLV9001SIDCKR
SC70
DCK
6
3000
180.0
180.0
18.0
TLV9001TIDCKR
SC70
DCK
5
3000
190.0
190.0
30.0
TLV9001UIDBVR
SOT-23
DBV
5
3000
210.0
185.0
35.0
TLV9002IDDFR
SOT-23-THIN
DDF
8
3000
210.0
185.0
35.0
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Nov-2021
Pack Materials-Page 2



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