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BAS70LP 数据表(PDF) 12 Page - FutureWafer Tech Co.,Ltd |
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BAS70LP 数据表(HTML) 12 Page - FutureWafer Tech Co.,Ltd |
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12 / 18 page ![]() 12 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode 6-1. Taping and Reel Specification-SOT23 & SOT323 6-2. Embossed Carrier Tape Specification-SOT23 & SOT323 6. Packing Dimension W D D1 E F P P0 P2 t W Value 8 mm 1.5 ±0.1 1.3 Max. 1.75 ±0.1 3.5 ±0.05 4 ±0.1 4 ±0.1 2 ±0.1 0.4 Max. 8 ±0.3 A0 / B0 / K0 Determined by Component Size. The Clearance Between The Component And The Cavity Must Comply to The Rotational and Lateral Movement Requirement Provided in Figures in The “Maximum Component Movement in Tape Pocket” Section. Unit: mm Taping Width Tape Orientation 8mm Direction Of Feed |
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