REFVDD, REF, REFIN, OVDD to GND ..................-0.3V to +4V

AVDD, DVDD to GND .............................................-0.3V to +2V

DGND to AGND, REFGND ..................................-0.3V to +0.3V

+4V or ±130mA

SCLK, DIN, DOUT, CNVST, to GND........... -0.3V to the lower of

Maximum Current into Any Pin...........................................50mA

TQFN (derate 30.30mW/°C above +70°C).............2424.2mW

Operating Temperature Range........................... -40°C to +85°C

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow).......................................+260°C

TQFN

(Note 1)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

ANALOG INPUT

Input Voltage Range (Note 3)

(AIN+) - (AIN-)

V

Absolute Input Voltage Range

AIN+, AIN- relative to AGND

-0.1

0.1

V

Common-Mode Input Range

[(AIN+) + (AIN-)]/2

0.1

+ 0.1

V

Input Leakage Current

Acquisition phase

-1

0.001

+1

µA

Input Capacitance

32

pF

STATIC PERFORMANCE (Note 4)

Resolution

N

16

Bits

Resolution

LSB

100.7

µV

No Missing Codes

16

Bits

Offset Error (Note 4)

-1

±0.1

+1

LSB

Offset Temperature Coefficient

±0.001

LSB/°C

Gain Error

Referred to REFIN reference input

-12

±2

+12

LSB

Gain Error Temperature

Coefficient (Note 5)

Referred to REFIN reference input

±0.02

LSB/°C

Gain Error

Referred to REF pins

-3

±1

+3

LSB

Gain Error Temperature

Coefficient (Note 5)

Referred to REF pins

±0.01

LSB/°C

Integral Nonlinearity

INL

-0.5

±0.1

+0.5

LSB

www.maximintegrated.com

Maxim Integrated │ 4

MAX11901

16-Bit, 1.6Msps, Low-Power,

Fully Differential SAR ADC

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

Electrical Characteristics