4.1

RoHS and Solder Reflow Information

The PD69101 device is rated RoHS 6/6. The package is lead (Pb)-free, with a 100% matte tin finish. The package

peak temperature for solder reflow (40 seconds maximum exposure) is 260 °C (0 °C, –5 °C).

The following table lists the classification reflow profile information.

Table 4-2. Classification Reflow Profiles

Profile Feature

Pb-Free Assembly

3 °C/second max

Pre-heat:

150 °C

200 °C

60 seconds–180 seconds

Time maintained above:

217 °C

60 seconds–150 seconds

Peak/classification temperature

See Figure 4-2

Time within 5 °C of actual peak temperature (tp)

20 seconds–40 seconds

Ramp-down rate

6 °C/second max

Time 25 °C to peak temperature

8 minutes max

Note:  All temperatures refer to the top-side of the package, measured on the package body surface.

The following illustration shows the classification reflow profile of the PD69101 device.

Figure 4-2. Classification Reflow Profile Diagram

Note:  Exceeding these ratings can damage the device.

PD69101

Package Specifications

and its subsidiaries

Datasheet

DS00004280A-page 21