SY75602A datasheet(7/26 Pages) MICROCHIP

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2021 Microchip Technology Inc. and its subsidiaries

DS20006508B-page 7

SY75602A/02B/603A/03B/604A/04B

FIGURE 1-1:

Single-Ended Measurement Points for Absolute Cross Point and Swing.

FIGURE 1-2:

Single-Ended Measurement Points for Delta Cross Point.

FIGURE 1-3:

Single-Ended Measurement Points for Rise and Fall Time Matching.

TEMPERATURE SPECIFICATIONS

Parameters

Symbol 8-Lead VDFN CL

1.4 mm x 1.6 mm

16-Lead VQFN

3 mm x 3 mm

Unit

Condition

Thermal Resistances

Junction-to-Ambient Thermal Resistance

JA

138

35.7

°C/W

Still air

132

30.8

1m/s airflow

127

28.6

2.5m/s airflow

Junction-to-Board Thermal Resistance

JB

104

°C/W —

Junction-to-Case Thermal Resistance

JC

105

49.5

°C/W —

Thermal Characterization, Junction-

to-Top of Package

ΨJT

11.5

°C/W Still air

OUTx_n

OUTx_p

Vcross_max = 550mV

Vcross_min = 250mV

Vmax = 1.15V

Vmin = -0.3V

OUTx_n

OUTx_p

Vcross_delta = 140 mV

OUTx_n

OUTx_p

Vcross_median

Vcross_median + 75mV

Vcross_median – 75mV

Vcross_median

tfall

trise

Rise-fall matching = MIN[|trise – tfall|/trise,|trise – tfall|/tfall

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