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SY75603B 数据表(PDF) 5 Page - Microchip Technology |
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SY75603B 数据表(HTML) 5 Page - Microchip Technology |
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5 / 26 page ![]() 2021 Microchip Technology Inc. and its subsidiaries DS20006508B-page 5 SY75602A/02B/603A/03B/604A/04B Clock Source DC Impedance (OUTx_n) for part with 85Ω embedded differential series resistance (parts with suffix “A”) ZC-DC_OUT_n 34 — 51 Ω Note 1, Note 9 Clock Source DC Impedance (OUTx_p) for part with 100Ω embedded differential series resistance (parts with suffix “B”) ZC-DC_OUT_p 40 — 60 Ω Note 1, Note 9 Clock Source DC Impedance (OUTx_n) for part with 100Ω embedded differential series resistance (parts with suffix “B”) ZC-DC_OUT_n 40 — 60 Ω Note 1, Note 9 Output Frequency FMAX 0 — 250 MHz — Output to Output Skew tOOSK — — 30 ps — Device to Device Output Skew tPOOSK — — 50 ps — Input to Output Delay tIOD 0.9 1.2 1.5 ns — Output Enable Time tEN — — 3.5 cycles Note 12 Output Disable Time tDIS — — 4.5 cycles Note 12 Note 1: Measurement taken from single ended waveform. 2: Measurement taken from differential waveform. 3: Measured from –150 mV to +150 mV on the differential waveform (derived from OUTx_p to OUTx_n). The signal must be monotonic through the measurement region for rise and fall time. The 300 mV measurement window is centered on the differential zero crossing. See Figure 1-5. 4: Measured at crossing point where the instantaneous voltage value of the rising edge of OUTx_p equals the falling edge of OUTx_n. See Figure 1-1. 5: Refers to the total variation from the lowest crossing point to the highest, regardless of which edge is crossing. Refers to all crossing points for this measurement. See Figure 1-1. 6: Defined as the maximum instantaneous voltage including overshoot. See Figure 1-1. 7: Defined as the minimum instantaneous voltage including undershoot. See Figure 1-1. 8: Defined as the total variation of all crossing voltages of Rising OUTx_p and Falling OUTx_n. This is the maximum allowed variance in VCROSS for any particular system. See Figure 1-2. 9: System board compliance measurements must use the test load card described in Figure 1-7. OUTx_p and OUTx_n are to be measured at the load capacitors CLOAD. Single-ended probes must be used for measurements requiring single-ended measurements. Either single-ended probes with math or differential probe can be used for differential measurements. 10: tSTABLE is the time the differential clock must maintain a minimum ±150 mV differential voltage after rising/falling edges before it is allowed to droop back into the VRB ±100 mV differential range. See Figure 1-6. 11: Matching applies to rising edge rate for OUTx_p and falling edge rate for OUTx_n. It is measured using a ±75 mV window centered on the median cross point where OUTx_p rising meets OUTx_n falling. The median cross point is used to calculate the voltage thresholds the oscilloscope is to use for the edge rate calculations. The Rise Edge Rate of OUTx_p should be compared to the Fall Edge Rate of OUTx_n; the maximum allowed difference should not exceed 20% of the slowest edge rate. See Figure 1-3. 12: Output Enable control pins are synchronous with the input clock and it takes four rising edges before out- puts get enabled and five rising edges before outputs get disabled. Hence the minimum input frequency is greater than 0 Hz. Once the outputs are enabled the input clock frequency can be reduced to 0 Hz. OUTPUT ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VDD = 3.3V ±10%, 2.5V±10%; 1.8V±10%; TA = –40°C to +105°C, CLOAD = 2 pF unless noted. Parameter Symbol Min. Typ. Max. Units Conditions |
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