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ADP1764ACPZ-1.3-R7 数据表(PDF) 18 Page - Analog Devices |
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ADP1764ACPZ-1.3-R7 数据表(HTML) 18 Page - Analog Devices |
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18 / 20 page ![]() ADP1764 Data Sheet Rev. A | Page 18 of 20 140 0 0 1.4 VIN – VOUT (V) 20 40 60 80 100 120 0.2 0.4 0.6 0.8 1.0 1.2 0.1A 1.0A 2.0A 3.0A 4.0A TJ MAX Figure 53. 1000 mm2 of PCB Copper, TB = 50°C, LFCSP 140 0 0 1.4 VIN – VOUT (V) 20 40 60 80 100 120 0.2 0.4 0.6 0.8 1.0 1.2 0.1A 1.0A 2.0A 3.0A 4.0A TJ MAX Figure 54. 500 mm2 of PCB Copper, TB = 50°C, LFCSP 140 0 0 1.4 VIN – VOUT (V) 20 40 60 80 100 120 0.2 0.4 0.6 0.8 1.0 1.2 0.1A 1.0A 2.0A 3.0A 4.0A TJ MAX Figure 55. 100 mm2 of PCB Copper, TB = 50°C, LFCSP TB = 91.7°C TADP1764 = 109°C Figure 56. Thermal Image of the ADP1764 Evaluation Board at ILOAD = 4 A, VIN = 1.5 V, VOUT = 1.3 V, TB = 91.7°C Figure 56 shows a thermal image of the ADP1764 evaluation board operating at a 4 A current load. The total power dissipation on the ADP1764 is 744 mW, which makes the temperature on the surface of the device higher by 17.3°C than the temperature of the evaluation board. |
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