ADP220/ADP221

Data Sheet

Rev. H | Page 16 of 20

PRINTED CIRCUIT BOARD (PCB) LAYOUT CONSIDERATIONS

Heat dissipation from the package can be improved by

increasing the amount of copper attached to the pins of the

ADP220/ADP221. However, as shown in Table 6, a point of

diminishing returns eventually is reached, beyond which an

increase in the copper size does not yield significant heat

dissipation benefits.

Place the input capacitor as close as possible to the VIN and

GND pins. Place the output capacitors as close as possible to

the VOUT1, VOUT2, and GND pins. Use 0402 or 0603

size capacitors and resistors to achieve the smallest possible

footprint solution on boards where area is limited.

Figure 40. Example of PCB Layout, Top Side

Figure 41. Example of PCB Layout, Bottom Side