Absolute Maximum Ratings

RS+ and RS- to GND .............................................. -42V to +80V

RS+ to RS- ............................................................................. ±2V

derate 16.7mW/°C above +70°C)................................ 1333.3mW

Operating Temperature Range ...........................-40°C to +125°C

Junction Temperature ....................................................... +150°C

Storage Temperature Range ..............................-65°C to +150°C

Lead Temperature (soldering, 10s)...................................+300°C

Soldering Temperature (reflow) ........................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the

device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Package Information

8 TDFN

Package Code

T823Y+3C

Outline Number

21-100417

Land Pattern Number

90-0091

Thermal Resistance, Four-Layer Board:

60°C/W

11°C/W

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages.

Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different

suffix character, but the drawing pertains to the package regardless of RoHS status.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a

four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/

thermal-tutorial.

MAX49921

0 to 70V, High-Precision Current-Sense Amplifier

www.analog.com

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