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2017 - 2022 Microchip Technology Inc. and its subsidiaries

DS20005736B-page 11

LP2951

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Lead Temperature Range

—

—

260

—

°C

—

Junction Operating Temperature

–40

—

+125

°C

—

Storage Temperature Range

–65

—

+125

°C

—

Package Thermal Resistances

Thermal Resistance, DIP Package

—

105

—

°C/W Soldered directly to a PC

board

—

40

—

°C/W —

Thermal Resistance, SOIC Package

—

160

—

°C/W

Typically mounting on a

1'' square copper-clad

FR4 circuit board

—

25

—

°C/W —

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.