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STL52N60DM6 数据表(PDF) 2 Page - STMicroelectronics |
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STL52N60DM6 数据表(HTML) 2 Page - STMicroelectronics |
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2 / 14 page ![]() 1 Electrical ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit VGS Gate-source voltage ±25 V ID(1) Drain current (continuous) at TC = 25 °C 45 A Drain current (continuous) at TC = 100 °C 28 A IDM(2) Drain current (pulsed) 128 A PTOT Total power dissipation at TC = 25 °C 174 W dv/dt(3) Peak diode recovery voltage slope 100 V/ns di/dt(3) Peak diode recovery current slope 1000 A/μs dv/dt(4) MOSFET dv/dt ruggedness 100 V/ns Tstg Storage temperature range -55 to 150 °C TJ Operating junction temperature range °C 1. Referred to TO-247 package. 2. Pulse width is limited by safe operating area. 3. ISD ≤ 45 A, VDS (peak) < V(BR)DSS, VDD = 400 V 4. VDS ≤ 480 V. Table 2. Thermal data Symbol Parameter Value Unit RthJC Thermal resistance, junction-to-case 0.72 °C/W RthJB (1) Thermal resistance, junction-to-board 45 °C/W 1. When mounted on FR-4 board of 1 inch², 2oz Cu. Table 3. Avalanche characteristics Symbol Parameter Value Unit IAR Avalanche current, repetitive or not repetitive (pulse width limited by TJ max.) 8 A EAS Single pulse avalanche energy (starting TJ = 25 °C, ID = IAR, VDD = 50 V) 690 mJ STL52N60DM6 Electrical ratings DS12975 - Rev 3 page 2/14 |
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