Absolute Maximum Ratings

IN_H to GND .......................................................... -0.3V to +42V

ENABLE to GND .................................................... -0.3V to +42V

OUT to GND ........................................................... -0.3V to +12V

SET to GND............................................................ -0.3V to +42V

RESET to GND....................................................... -0.3V to +42V

SETOV to GND ........................................................ -0.3V to +6V

Timeout to GND ....................................................... -0.3V to +6V

Maximum Current (all pins except IN and OUT) ..................50mA

Continuous Power Dissipation (TA = 70°C) TDFN (Multilayer

board) (TDFN (derate 24.4mW/°C above +70°C)).........1951 mW

Operating Junction Temperature .......................-40°C to +150°C

Junction Temperature ....................................................... +150°C

Storage Temperature Range ..............................-65°C to +150°C

Lead Temperature (soldering 10s)....................................+300°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the

device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Package Information

TDFN 3mm x 3mm

Package Code

T833+2C

Outline Number

21-0137

Land Pattern Number

90-0059

Thermal Resistance, Single-Layer Board:

54°C/W

8°C/W

Thermal Resistance, Four-Layer Board:

41°C/W

8°C/W

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates

RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal

considerations, refer to www.maximintegrated.com/thermal-tutorial.

Electrical Characteristics

(Note 1).)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Electrical Characteristics Table

Supply Voltage Range

Continuous

3.5

36

V

For ≤ 1s

42

Supply Current

10

29

µA

38

Shutdown Supply

Current

2

3

µA

7

MAX25210

Automotive Ultra Low Quiescent Current Linear

Regulator Family

www.maximintegrated.com

Maxim Integrated | 3