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STPS2170 数据表(PDF) 4 Page - STMicroelectronics |
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STPS2170 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 12 page ![]() Figure 7. Forward voltage drop versus forward current (typical values) 0.01 0.10 1.00 10.00 0.0 0.1 0.2 0.3 0.7 0.8 0.9 1.0 0.4 0.5 0.6 360° α IF(A) T j = 125 °C VF(V) T j = 25 °C Figure 8. Forward voltage drop versus forward current (maximum values) 0.01 0.10 1.00 10.00 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 360° α IF(A) T j = 125 °C VF(V) T j = 25 °C Figure 9. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat, SMA Flat Notch) 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 R (°C/W) th(j-a) S(Cu)(cm²) Epoxy printed circuit board FR4, copper thickness: 35 µm SMA Flat Notch SMA Flat STPS2170 Characteristics (curves) DS10644 - Rev 2 page 4/12 |
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