MIC5201 datasheet(13/22 Pages) MICROCHIP

部件名	MIC5201

功能描述	150 mA Low Dropout Regulator

PDF	22 Pages

Scroll/Zoom	100%

制造商	MICROCHIP [Microchip Technology]

网页	http://www.microchip.com

标志

13 / 22 page

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2017 - 2022 Microchip Technology Inc. and its subsidiaries

DS20005718D-page 13

MIC5201

4.7

Nominal Power Dissipation and

Die Temperature

The MIC5201-x.xYM at a +25°C ambient temperature

will operate reliably at up to 625 mW power dissipation

when mounted in the “worst case” manner described

above. At an ambient temperature of +55°C, the device

may safely dissipate 440 mW. These power levels are

equivalent to a die temperature of +85°C, the

recommended maximum temperature for non-military

grade silicon integrated circuits.

For MIC5201-x.xYS (SOT-223 package) heat sink

characteristics, please refer to Application Hint 17, P.C.

Board Heat Sinking.

FIGURE 4-4:

Minimum Recommended

SOIC-8 PCB Pads Size.

250 mil

30 mil

50 mil

150 mil

50 mil

MIC5201 数据表(PDF) 13 Page - Microchip Technology