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SISC06DN 数据表(PDF) 1 Page - Vishay Siliconix

部件名 SISC06DN
功能描述  N-Channel 30 V (D-S) MOSFET
PDF  9 Pages
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制造商  VISHAY [Vishay Siliconix]
网页  http://www.vishay.com
标志 VISHAY - Vishay Siliconix

SISC06DN 数据表(HTML) 1 Page - Vishay Siliconix

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SiSC06DN
www.vishay.com
Vishay Siliconix
S21-0841-Rev. B, 09-Aug-2021
1
Document Number: 62944
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
N-Channel 30 V (D-S) MOSFET
FEATURES
• TrenchFET® Gen IV power MOSFET
•SkyFET® with monolithic Schottky diode
• 100 % Rg and UIS tested
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Personal computers and servers
• Synchronous buck
• Synchronous rectification
•DC/DC conversion
Notes
a. Surface mounted on 1" x 1" FR4 board
b. t = 10 s
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
e. Maximum under steady state conditions is 81 °C/W
f. Based on TC = 25 °C
g. Package limited
PRODUCT SUMMARY
VDS (V)
30
RDS(on) max. (
Ω) at VGS = 10 V
0.0027
RDS(on) max. (
Ω) at VGS = 4.5 V
0.0040
Qg typ. (nC)
17.5
ID (A)
40 g
Configuration
Single
PowerPAK® 1212-8 Single
Top View
1
3.3
mm
3.3
mm
Bottom View
1
S
1
S
2
S
3
S
4
G
D
8
D
7
D
6
D
5
N-Channel MOSFET
G
S
D
Schottky
Diode
ORDERING INFORMATION
Package
PowerPAK 1212-8
Lead (Pb)-free and halogen-free
SiSC06DN-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-source voltage
VDS
30
V
Gate-source voltage
VGS
+20, -16
Continuous drain current (TJ = 150 °C)
TC = 25 °C
ID
40 g
A
TC = 70 °C
40 g
TA = 25 °C
27.6 a, b
TA = 70 °C
25.2 a, b
Pulsed drain current (t = 100 μs)
IDM
100
Continuous source-drain diode current
TC = 25 °C
IS
40 g
TA = 25 °C
3.3 a, b
Single pulse avalanche current
L = 0.1 mH
IAS
15
Single pulse avalanche energy
EAS
11.25
mJ
Maximum power dissipation
TC = 25 °C
PD
46.3
W
TC = 70 °C
29.6
TA = 25 °C
3.7 a, b
TA = 70 °C
3.1 a, b
Operating junction and storage temperature range
TJ, Tstg
-55 to +150
°C
Soldering recommendations (peak temperature) c, d
260
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum junction-to-ambient a, e
t
≤ 10 s
RthJA
25
33
°C/W
Maximum junction-to-case (drain)
Steady state
RthJC
2.1
2.7


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