AD8202-KGD

Known Good Die

Rev. 0 | Page 6 of 8

OUTLINE DIMENSIONS

SIDE VIEW

TOP VIEW

(CIRCUIT SIDE)

1.165

1.180

0.391

0.381

0.371

1

2

3

4

5

6

7

8

Figure 3. 8-Pad Bare Die [CHIP]

(C-8-1)

Dimensions shown in millimeters

DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS

Table 4. Die Specifications

Parameter

Value

Unit1

Chip Size

1090 × 1105

μm

Scribe Line Width

75 × 75

μm

Die Size

1.180 × 1.165

mm (maximum)

Thickness

381 ± 10

μm

Bond Pad

92 × 92

μm (minimum)

Bond Pad Composition

0.5 AlCu

%

Backside

Bare

N/A

Passivation

Polymide

N/A

1

N/A means not applicable.

Table 5. Assembly Recommendations

Assembly Component

Recommendation

Die Attach

No special requirements

Bonding Method

Gold ball or aluminum wedge

Bonding Sequence

Any

ORDERING GUIDE

Model1

Temperature Range

Package Option

AD8202W-KGD-R7

−40°C to +150°C

C-8-1

1

W = Qualified for Automotive Applications.

AUTOMOTIVE PRODUCTS

The AD8202W model is available with controlled manufacturing to support the quality and reliability requirements of automotive

applications. Note that this automotive model may have specifications that differ from the commercial models; therefore, designers

should review the Specifications section of this data sheet carefully. Only the automotive grade product shown is available for use in

automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to

obtain the specific Automotive Reliability reports for these models.