数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

AD8479TRZ-EP-R7 数据表(PDF) 4 Page - Analog Devices

部件名 AD8479TRZ-EP-R7
功能描述  Very High Common-Mode Voltage Precision Difference Amplifier
PDF  7 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

AD8479TRZ-EP-R7 数据表(HTML) 4 Page - Analog Devices

  AD8479TRZ-EP-R7 Datasheet HTML 1Page - Analog Devices AD8479TRZ-EP-R7 Datasheet HTML 2Page - Analog Devices AD8479TRZ-EP-R7 Datasheet HTML 3Page - Analog Devices AD8479TRZ-EP-R7 Datasheet HTML 4Page - Analog Devices AD8479TRZ-EP-R7 Datasheet HTML 5Page - Analog Devices AD8479TRZ-EP-R7 Datasheet HTML 6Page - Analog Devices AD8479TRZ-EP-R7 Datasheet HTML 7Page - Analog Devices  
Zoom Inzoom in Zoom Outzoom out
 4 / 7 page
background image
AD8479-EP
Enhanced Product
Rev. 0 | Page 4 of 7
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
VS
±18 V
Input Voltage Range
Continuous
±600 V
Common-Mode and Differential,
10 sec
±900 V
Output Short-Circuit Duration
Indefinite
REF(−) and REF(+)
−VS − 0.3 V to +VS + 0.3 V
Maximum Junction Temperature
150°C
Operating Temperature Range
−55°C to +125°C
Storage Temperature Range
−65°C to +150°C
Lead Temperature (Soldering, 60 sec)
300°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θJA is the natural convection, junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure.
θJC is the junction to case thermal resistance.
Table 3. Thermal Resistance
Package Type
θJA1
θJC2
Unit
R-8
122
87
°C/W
1
Thermal impedance simulated values are based on JEDEC 2S2P thermal test
board. See JEDEC JESD-51.
2
Thermal impedance simulated values are based on JEDEC 1S0P thermal test
board. See JEDEC JESD51.
ESD CAUTION



Html Pages

1 2 3 4 5 6 7


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com