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ADM3066EBCPZ-R7 数据表(PDF) 26 Page - Analog Devices

部件名 ADM3066EBCPZ-R7
功能描述  3.0 V to 5.5 V, 짹12 kV IEC ESD Protected, 500 kbps/50 Mbps RS-485 Transceivers
PDF  27 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADM3066EBCPZ-R7 数据表(HTML) 26 Page - Analog Devices

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ADM3061E/ADM3062E/ADM3063E/ADM3064E/ADM3065E/ADM3066E/ADM3067E/ADM3068E
Data Sheet
Rev. G | Page 26 of 27
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AB
14
8
7
1
6.20 (0.2441)
5.80 (0.2283)
4.00 (0.1575)
3.80 (0.1496)
8.75 (0.3445)
8.55 (0.3366)
1.27 (0.0500)
BSC
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
COPLANARITY
0.10
8°
0°
45°
Figure 54. 14-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-14)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model1
Temperature Range
Package Description
Package Option
Marking Code
ADM3061EARZ
−40°C to +85°C
8-Lead Standard Small Outline Package [SOIC_N]
R-8
ADM3061EARZ-R7
−40°C to +85°C
8-Lead Standard Small Outline Package [SOIC_N]
R-8
ADM3061EBRZ
−40°C to +125°C
8-Lead Standard Small Outline Package [SOIC_N]
R-8
ADM3061EBRZ-R7
−40°C to +125°C
8-Lead Standard Small Outline Package [SOIC_N]
R-8
ADM3061EARMZ
−40°C to +85°C
8-Lead Mini Small Outline Package [MSOP]
RM-8
MBY
ADM3061EARMZ-R7
−40°C to +85°C
8-Lead Mini Small Outline Package [MSOP]
RM-8
MBY
ADM3061EBRMZ
−40°C to +125°C
8-Lead Mini Small Outline Package [MSOP]
RM-8
MC0
ADM3061EBRMZ-R7
−40°C to +125°C
8-Lead Mini Small Outline Package [MSOP]
RM-8
MC0
ADM3062EACPZ
−40°C to +85°C
10-Lead Lead Frame Chip Scale Package [LFCSP]
CP-10-9
MCC
ADM3062EACPZ-R7
−40°C to +85°C
10-Lead Lead Frame Chip Scale Package [LFCSP]
CP-10-9
MCC
ADM3062EBCPZ
−40°C to +125°C
10-Lead Lead Frame Chip Scale Package [LFCSP]
CP-10-9
MCD
ADM3062EBCPZ-R7
−40°C to +125°C
10-Lead Lead Frame Chip Scale Package [LFCSP]
CP-10-9
MCD
ADM3062EARMZ
−40°C to +85°C
10-Lead Mini Small Outline Package [MSOP]
RM-10
MC7
ADM3062EARMZ-R7
−40°C to +85°C
10-Lead Mini Small Outline Package [MSOP]
RM-10
MC7
ADM3062EBRMZ
−40°C to +125°C
10-Lead Mini Small Outline Package [MSOP]
RM-10
MC8
ADM3062EBRMZ-R7
−40°C to +125°C
10-Lead Mini Small Outline Package [MSOP]
RM-10
MC8
ADM3063EARZ
−40°C to +85°C
14-Lead Standard Small Outline Package [SOIC_N]
R-14
ADM3063EARZ-R7
−40°C to +85°C
14-Lead Standard Small Outline Package [SOIC_N]
R-14
ADM3063EBRZ
−40°C to +125°C
14-Lead Standard Small Outline Package [SOIC_N]
R-14
ADM3063EBRZ-R7
−40°C to +125°C
14-Lead Standard Small Outline Package [SOIC_N]
R-14
ADM3064EARZ
−40°C to +85°C
14-Lead Standard Small Outline Package [SOIC_N]
R-14
ADM3064EARZ-R7
−40°C to +85°C
14-Lead Standard Small Outline Package [SOIC_N]
R-14
ADM3064EBRZ
−40°C to +125°C
14-Lead Standard Small Outline Package [SOIC_N]
R-14
ADM3064EBRZ-R7
−40°C to +125°C
14-Lead Standard Small Outline Package [SOIC_N]
R-14
ADM3065EARZ
−40°C to +85°C
8-Lead Standard Small Outline Package [SOIC_N]
R-8
ADM3065EARZ-R7
−40°C to +85°C
8-Lead Standard Small Outline Package [SOIC_N]
R-8
ADM3065EBRZ
−40°C to +125°C
8-Lead Standard Small Outline Package [SOIC_N]
R-8
ADM3065EBRZ-R7
−40°C to +125°C
8-Lead Standard Small Outline Package [SOIC_N]
R-8
ADM3065EARMZ
−40°C to +85°C
8-Lead Mini Small Outline Package [MSOP]
RM-8
MC1
ADM3065EARMZ-R7
−40°C to +85°C
8-Lead Mini Small Outline Package [MSOP]
RM-8
MC1
ADM3065EBRMZ
−40°C to +125°C
8-Lead Mini Small Outline Package [MSOP]
RM-8
MC2
ADM3065EBRMZ-R7
−40°C to +125°C
8-Lead Mini Small Outline Package [MSOP]
RM-8
MC2



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