7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

22

V

Analog inputs,

−12

12

V

Common - mode

−20

120

V

REF1, REF2,

NC inputs

GND − 0.3

V

Output

GND – 0.3

Vs + 0.3

V

Operating temperature

–55

150

°C

Junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not

imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating

Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be

fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

VIN+ and VIN– are the voltages at the IN+ and IN– pins, respectively.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per ANSI/ESDA/

JEDEC JS-002, all pins(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Common-mode input range

−4

48

110

V

Operating supply range

2.7

5

20

V

Ambient temperature

–40

125

°C

7.4 Thermal Information

THERMAL METRIC(1)

INA241x

UNIT

DDF (SOT23)

DGK (VSSOP)(2)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

129.7

TBD

°C/W

Junction-to-case (top) thermal resistance

58

TBD

°C/W

Junction-to-board thermal resistance

52.6

TBD

°C/W

Junction-to-top characterization parameter

2.3

TBD

°C/W

Junction-to-board characterization parameter

52.3

TBD

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

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SBOSA30 – MARCH 2022

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