ADM7150ACPZ-1.8-R2 datasheet(21/24 Pages) AD

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Data Sheet

ADM7150

Thermal Characterization Parameter (ΨJB)

When board temperature is known, use the thermal

characterization parameter, ΨJB, to estimate the junction

temperature rise (see Figure 69 and Figure 70). Maximum

junction temperature (TJ) is calculated from the board temperature

(TB) and power dissipation (PD) using the following formula:

TJ = TB + (PD × ΨJB)

(5)

The typical value of ΨJB is 15.1°C/W for the 8-lead LFCSP

package and 17.9°C/W for the 8-lead SOIC package.

TOTAL POWER DISSIPATION (W)

9.0

8.5

8.0

7.0

6.0

7.5

6.5

5.5

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

160

140

120

100

TB = 25°C

TB = 50°C

TB = 65°C

TB = 85°C

TJ MAX

Figure 69. Junction Temperature vs. Total Power Dissipation for

the 8-Lead LFCSP

TOTAL POWER DISSIPATION (W)

5.5

7.5

7.0

6.5

6.0

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

160

140

120

100

TB = 25°C

TB = 50°C

TB = 65°C

TB = 85°C

TJ MAX

Figure 70. Junction Temperature vs. Total Power Dissipation for

the 8-Lead SOIC

PRINTED CIRCUIT BOARD LAYOUT

CONSIDERATIONS

Place the input capacitor as close as possible to the VIN and GND

pins. Place the output capacitor as close as possible to the VOUT

and GND pins. Place the bypass capacitors for VREG, VREF, and

VBYP close to the respective pins and GND. Use of an 0805,

0603, or 0402 size capacitor achieves the smallest possible

footprint solution on boards where area is limited.

Figure 71. Example 8-Lead LFCSP PCB Layout

Figure 72. Example 8-Lead SOIC PCB Layout

Rev. 0 | Page 21 of 24

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