Data Sheet

ADM7151

Rev. B | Page 23 of 24

OUTLINE DIMENSIONS

2.44

2.34

2.24

0.30

0.25

0.20

PIN 1 INDEX

AREA

0.80

0.75

0.70

1.70

1.60

1.50

0.203 REF

0.05 MAX

0.02 NOM

0.50 BSC

3.10

3.00 SQ

2.90

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-229-W3030D-4

0.20 MIN

8

1

5

4

SEATING

PLANE

TOP VIEW

SIDE VIEW

EXPOSED

PAD

BOTTOM VIEW

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET

P IN 1

IN D IC AT O R AR E A OP T IO N S

(SEE DETAIL A)

1

DETAIL A

(JEDEC 95)

Figure 71. 8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-8-11)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MS-012-A A

1.27

0.40

1.75

1.35

2.41

0.356

0.457

4.00

3.90

3.80

6.20

6.00

5.80

5.00

4.90

4.80

0.10 MAX

0.05 NOM

3.81 REF

0.25

0.17

8°

0°

0.50

0.25

45°

COPLANARITY

0.10

1.04 REF

8

1

4

5

1.27 BSC

SEATING

PLANE

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

BOTTOM VIEW

TOP VIEW

0.51

0.31

1.65

1.25

3.098

Figure 72. 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP]

Narrow Body

(RD-8-2)

Dimensions shown in millimeters