TSHA6200, TSHA6201, TSHA6202, TSHA6203

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Vishay Semiconductors

Rev. 1.9, 24-Aug-11

2

Document Number: 81021

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Fig. 1 - Power Dissipation Limit vs. Ambient Temperature

Fig. 2 - Forward Current Limit vs. Ambient Temperature

PARAMETER

TEST CONDITION

SYMBOL

VALUE

UNIT

Reverse voltage

5V

Forward current

100

mA

Peak forward current

200

mA

Surge forward current

2.5

A

Power dissipation

180

mW

Junction temperature

100

°C

Operating temperature range

- 40 to + 85

°C

Storage temperature range

- 40 to + 100

°C

Soldering temperature

t

≤ 5 s, 2 mm from case

260

°C

Thermal resistance junction/ambient

J-STD-051, leads 7 mm, soldered on PCB

230

K/W

0

20

40

60

80

100

120

140

160

180

200

0

1020

3040506070

8090 100

21142

T

R

0

20

40

60

80

100

120

0

10

203040

50607080

90 100

T

21143

R

PARAMETER

TEST CONDITION

SYMBOL

MIN.

TYP.

MAX.

UNIT

Forward voltage

1.5

1.8

V

- 1.6

mV/K

Reverse current

100

μA

Junction capacitance

20

pF

Temperature coefficient of

TK

- 0.7

%/K

Angle of half intensity

ϕ

± 12

deg

Peak wavelength

875

nm

Spectral bandwidth

Δλ

80

nm

Temperature coefficient of

TK

0.2

nm/K

Rise time

600

ns

300

ns

Fall time

600

ns

300

ns

Virtual source diameter

d

3.7

mm