24LC64XT-ESLASHST datasheet(35/51 Pages) MICROCHIP

35 / 51 page

 1997-2022 Microchip Technology Inc. and its subsidiaries

DS20001189U-page 35

24AA64/24FC64/24LC64

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

SEATING

PLANE

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Molded Package Width

Molded Package Thickness

Pitch

Standoff §

Units

Dimension Limits

1.27 BSC

–

0.51

0.36

1.77

0.05

–

MILLIMETERS

MIN

NOM

0.76

0.51

2.03

0.25

MAX

Overall Length

5.26 BSC

Terminal Thickness

0.15–0.25

–

0°

8°

Foot Angle

–

Lead Angle

1.75

1.98

–

Mold Draft Angle

7.94 BSC

5.25 BSC

8°

15°

0°

–

8-Lead Plastic Small Outline (SM) - Medium, 5.28 mm (.208 Inch) Body [SOIJ]

Microchip Technology Drawing C04-056 Rev D

DETAIL B

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or

§ – Significant Characteristic

protrusions shall not exceed 0.25mm per side.

SOIJ – JEITA/EIAJ Standard, Formerly called SOIC

4X 1

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