MAX17543 datasheet(2/19 Pages) MAXIM

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VIN to PGND .........................................................-0.3V to +48V

EN/UVLO to SGND ...............................................-0.3V to +48V

LX to PGND................................................-0.3V to (VIN + 0.3V)

BST to PGND........................................................-0.3V to +53V

BST to LX.............................................................-0.3V to +6.5V

BST to VCC ...........................................................-0.3V to +48V

CF, RESET, SS, MODE, SYNC,

RT to SGND .....................................................-0.3V to +6.5V

FB to SGND .........................................................-0.3V to +1.5V

VCC to SGND.......................................................-0.3V to +6.5V

SGND to PGND....................................................-0.3V to +0.3V

LX Total RMS Current ...........................................................±4A

Output Short-Circuit Duration....................................Continuous

Continuous Power Dissipation (TA = +70°C) (multilayer board)

TQFN (derate 30.3mW/ºC above TA = +70°C) ......2424.2mW

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -65°C to +160°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow).......................................+260°C

TQFN

Junction-to-Ambient Thermal Resistance (θJA) ..........33ºC/W

Junction-to-Case Thermal Resistance (θJC).................2ºC/W

(Note 1)

(VIN = VEN/UVLO = 24V, RRT = 40.2kΩ (500kHz), CVCC = 2.2μF, VPGND = VSGND = VMODE = VSYNC = 0V, LX = SS = RESET =

open, VBST to VLX = 5V, VFB = 1V, TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C. All voltages are

referenced to SGND, unless otherwise noted.) (Note 2)

Electrical Characteristics

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Package Thermal Characteristics

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability. Junction temperature greater than +125°C degrades operating lifetimes.

Absolute Maximum Ratings

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX UNITS

INPUT SUPPLY (VIN)

Input Voltage Range

VIN

4.5

Input Shutdown Current

IIN-SH

VEN/UVLO = 0V (shutdown mode)

2.8

4.5

µA

Input Quiescent Current

IQ_PFM

VFB = 1V, MODE = RT = open

118

VFB = 1V, MODE = open

162

IQ-DCM

DCM mode, VLX = 0.1V

1.16

1.8

IQ_PWM

Normal switching mode, fSW = 500kHz,

VFB = 0.8V

9.5

ENABLE/UVLO (EN/UVLO)

EN/UVLO Threshold

VENR

VEN/UVLO rising

1.19

1.215 1.26

VENF

VEN/UVLO falling

1.068

1.09 1.131

EN/UVLO Input Leakage Current

IEN

VEN/UVLO = 0V, TA = +25ºC

-50

+50

LDO

VCC Output Voltage Range

VCC

6V < VIN < 42V, IVCC = 1mA

4.75

5.25

1mA ≤ IVCC ≤ 25mA

VCC Current Limit

IVCC-MAX

VCC = 4.3V, VIN = 6V

26.5

100

VCC Dropout

VCC-DO

VIN = 4.5V, IVCC = 20mA

4.2

VCC UVLO

VCC_UVR

VCC rising

4.05

4.2

4.3

VCC_UVF

VCC falling

3.65

3.8

3.9

MAX17543

4.5V–42V, 2.5A, High-Efficiency,

Synchronous Step-Down DC-DC Converter

with Internal Compensation

www.maximintegrated.com

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