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ADL6010ACPZN-R2 数据表(PDF) 17 Page - Analog Devices |
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ADL6010ACPZN-R2 数据表(HTML) 17 Page - Analog Devices |
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17 / 23 page ![]() Data Sheet ADL6010 Rev. E | Page 17 of 23 BASIC CONNECTIONS The basic connections are shown in Figure 40. A dc supply of nominally 5 V is required. The bypass capacitors (C1 and C2) provide supply decoupling for the output buffer. Place these capacitors as close as possible to the VPOS pin. The exposed pad is internally connected to the IC ground and must be soldered down to a low impedance ground on the PCB. A filter capacitor (CLOAD) and series resistor (R1) may be inserted to form a low-pass filter for the output envelope. Small CLOAD values allow a quicker response to an RF burst waveform, and high CLOAD values provide signal averaging and noise reduction. RFIN RFCM VOUT COMM CLOAD (SEE TEXT) R1 100Ω VPOS C1 100pF C2 0.1µF 4 5 6 3 2 1 LINEARIZER ADL6010 Figure 40. Basic Connections PCB LAYOUT RECOMMENDATIONS Parasitic elements of the PCB such as coupling and radiation limit accuracy at very high frequencies. Ensure faithful power transmission from the connector to the internal circuit of the ADL6010. Microstrip and CPW are popular forms of transmission lines because of their ease of fabrication and low cost. In the ADL6010 evaluation board, a grounded CPW (GCPW) minimizes radiation effects and provides the maximum bandwidth by using two rows of grounding vias on both sides of the signal trace. Figure 41 shows the PCB layout of the ADL6010 evaluation board in detail. Minimize air gaps between the vias to ensure reliable transmission. Because a certain minimum distance between two adjacent grounding vias in a single row is needed, adding a second row of grounding vias on both sides of the GCPW is recommended. In this way, a much smaller equivalent air gap between grounding vias is achieved, and better transmission is accomplished. GND VIAS RFIN PAD Figure 41. ADL6010 Evaluation Board SYSTEM CALIBRATION AND ERROR CALCULATION The measured transfer function of the ADL6010 at 10 GHz is shown in Figure 42. This plots both the conformance error and the output voltage vs. the input level at +25°C, +85°C, +125°C, −40°C, and −55°C. Over the input level range from −30 dBm to +15 dBm, the output voltage varies from approximately 20 mV to 4.3 V. 4 3 2 1 0 –1 –2 –3 –4 10 1 0.1 0.01 0.001 PIN (dBm) –55°C –40°C +25°C +85°C +125°C 15 5 –5 –15 –25 20 10 0 –10 –20 –30 CALIBRATION AT –20dBm AND +5dBm Figure 42. Conformance Error and Output Voltage vs. RF Input Power (PIN) for Various Temperatures (−55°C, −40°C, +25°C, +85°C, and +125°C) at 10 GHz Using Two Point Calibration To achieve the highest measurement accuracy, perform calibration at the board level, as the IC scaling varies from device to device. Calibration begins by applying two or more known signal levels, VIN1 and VIN2, within the operating range of the IC, and noting the corresponding outputs, VOUT1 and VOUT2. From these measurements, the slope and intercept of the scaling is extracted. For a two point calibration, the calculations are as follows: Slope = (VOUT2 − VOUT1)/(VIN2 − VIN1) Intercept = VOUT1 − (Slope × VIN1) where: Each VIN is the equivalent peak input voltage to RFIN, at a 50 Ω input impedance. Once the slope and intercept are calculated and stored, use the following simple equations to calculate the unknown input power: VIN_CALCULATED = (VOUT (MEASURED) − Intercept)/Slope PIN_CALCULATED (dBm) = 10log10(1000 × (VIN_CALCULATED/√2)2/50) The conformance error is Error (dB) = PIN_CALCULATED (dBm) − PIN_IDEAL (dBm) Figure 42 includes a plot of this error at −55°C, −40°C, +25°C, +85°C, and +125°C when using a two point calibration with inputs at +5 dBm and –20 dBm. The relative error at these two calibration points is equal to 0 dB by definition. |
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