Data Sheet

ADP172

ABSOLUTE MAXIMUM RATINGS

analog.com

Rev. F | 5 of 17

Table 3.

Parameter

Rating

VIN to GND

−0.3 V to +4.0 V

VOUT to GND

−0.3 V to VIN

EN to GND

−0.3 V to +4.0 V

Storage Temperature Range

−65°C to +150°C

Operating Junction Temperature Range

−40°C to +125°C

Operating Ambient Temperature Range

−40°C to +85°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL DATA

Absolute maximum ratings apply only individually, not in combina-

tion. The ADP172 can be damaged when the junction temperature

limits are exceeded. Monitoring ambient temperature does not

cations with high power dissipation and poor thermal resistance, the

maximum ambient temperature may have to be derated.

In applications with moderate power dissipation and low PCB ther-

mal resistance, the maximum ambient temperature can exceed

the maximum limit as long as the junction temperature is within

formula:

based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is highly dependent on the

application and board layout. In applications where high maximum

power dissipation exists, close attention to thermal board design is

are based on a 4-layer, 4 in. × 3 in. PCB. Refer to JESD51-7 for

detailed information regarding board construction.

calculation using a 4-layer board. The Guidelines for Reporting

and Using Electronic Package Thermal Information: JESD51-12

states that thermal characterization parameters are not the same

ing through multiple thermal paths rather than a single path as

convection from the top of the package as well as radiation from

formula

Refer to JESD51-8 and JESD51-12 for more detailed information

THERMAL RESISTANCE

device soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

Unit

4-Ball, 0.5 mm Pitch WLCSP

260

58

°C/W

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.