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SP4425QCU 数据表(PDF) 2 Page - Sipex Corporation

部件名 SP4425QCU
功能描述  Electroluminescent Lamp Driver for Low Noise Applications
PDF  12 Pages
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制造商  SIPEX [Sipex Corporation]
网页  http://www.sipex.com
标志 SIPEX - Sipex Corporation

SP4425QCU 数据表(HTML) 2 Page - Sipex Corporation

  SP4425QCU Datasheet HTML 1Page - Sipex Corporation SP4425QCU Datasheet HTML 2Page - Sipex Corporation SP4425QCU Datasheet HTML 3Page - Sipex Corporation SP4425QCU Datasheet HTML 4Page - Sipex Corporation SP4425QCU Datasheet HTML 5Page - Sipex Corporation SP4425QCU Datasheet HTML 6Page - Sipex Corporation SP4425QCU Datasheet HTML 7Page - Sipex Corporation SP4425QCU Datasheet HTML 8Page - Sipex Corporation SP4425QCU Datasheet HTML 9Page - Sipex Corporation Next Button
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SP4425QDS/12
SP4425Q Electroluminescent Lamp Driver
© Copyright 1998 Sipex Corporation
2
(T= 25
°C; V
DD = 3.0V; see test circuit schematic page 6; Coil = 2mH/44ohms; COSC = 180pF, CINT = 820pF unless otherwise noted)
V
SS
HON
D1
Coil
C
OSC
EL2
V
DD
EL1
SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional operation of the device at
these ratings or any other above those indicated in the operation sections
of the specifications below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may affect reliability.
V
DD.......................................................................................................5V
Input Voltages/Currents
HON (pin1)........................................-0.5V to (V
DD + 0.5V)
COIL (pin3)............................................................100mA
Lamp Outputs..............................................................................230V
PP
Storage Temperature....................................................-65˚C to +150˚C
NOTES:
1. Dimensions are in Microns unless otherwise noted.
2. Bonding pads are 125x125 typ.
3. Outside dimensions are maximum, including scribe area.
4. Die thickness is 380 +/- 25 microns (15 mils +/- 1).
5. Pad center coordinates are relative to die center.
6. Die size 74 x 44 mils.
Power Dissipation Per Package
8-pin
µSOIC (derate 4.85mWoC above +70oC)...................390mW
The information furnished herein by Sipex has been carefully reviewed
for accuracy and reliability. Its application or use, however, is solely the
responsibility of the user. No responsibility for the use of this information
is assumed by Sipex, and this information shall not explicitly or implicitly
become part of the terms and conditions of any subsequent sales
agreement with Sipex. Specifications are subject to change without
prior notice. By the sale or transfer of this information, Sipex assumes
no responsibility for any infringement of patents or other rights of third
parties which may result from its use. No license or other proprietary
rights are granted by implication or otherwise under any patent or
patent rights of Sipex Corporation.
This data sheet specifies environmental parameters, final test conditions and limits as well suggested operating conditions.
For applications which require performance beyond the specified condition and or limits please consult the factory.
Bonding Diagram:
PAD
X
Y
261.0
427.0
EL1
813.0
429.0
EL2
813.0
28.0
D1
813.0
-172.0
COIL
767.0
-381.0
143.5
-412.0
-790.0
-157.5
HON
-785.5
402.0
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