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MIC5396 数据表(PDF) 4 Page - Microchip Technology |
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MIC5396 数据表(HTML) 4 Page - Microchip Technology |
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4 / 26 page ![]() MIC5396/7/8/9 DS20006264C-page 4 2019-2022 Microchip Technology Inc. and its subsidiaries Shutdown Current ISHDN — 0.05 1 µA VEN1 = VEN2 = 0V Ripple Rejection PSRR — 60 — dB f = 1 kHz; COUT = 1 µF Current Limit ILIM 400 630 900 mA VOUT = 0V Output Voltage Noise eN — 93 — µVRMS COUT = 1µF, 10 Hz to 100 kHz Auto-Discharge NFET Resistance RDS(ON) — 25 — Ω MIC5397, MIC5399 Only; VEN1 = VEN2 = 0V; VIN = 3.6V; IOUT = –3 mA Enable Inputs (EN1/EN2) Enable Pull-Down Resistor RPULL-DN — 4 — MΩ MIC5398, MIC5399 Enable Input Voltage VEN-LOW — — 0.2 V Logic Low VEN-HIGH 1.2 — — Logic High Enable Input Current MIC5396, MIC5397 IEN — 0.01 1 µA VEN = 0V — 0.01 1 VEN = 5.5V Enable Input Current MIC5398, MIC5399 IEN — 0.01 1 µA VEN = 0V — 1.4 2 VEN = 5.5V Turn-On Time tON — 50 125 µs COUT = 1 µF ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VIN1 = VEN1 = VOUT1 + 1V, VIN2 = VEN2 = VOUT2 + 1V, IOUT1 = IOUT2 = 100 µA; CIN1 = CIN2 = COUT1 = COUT2 = 1 µF; TA = +25°C. Bold values are valid for –40°C to +125°C, unless noted. (Note 1). Parameters Symbol Min. Typ. Max. Units Conditions Note 1: Specification for packaged product only. TEMPERATURE SPECIFICATIONS Parameters Symbol Min. Typ. Max. Units Conditions Temperature Ranges Junction Temperature Range TJ –40 — +125 °C Note 1 Storage Temperature Range TS –65 — +150 °C — Lead Temperature — — — 260 °C Soldering, 10 sec. Package Thermal Resistances Thermal Resistance, UDFN-8 JA — 172.6 — °C/W — Thermal Resistance, Extra Thin DFN-8 Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. |
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