FSA557

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4

Table 4. MAXIMUM RATINGS

Symbol

Parameter

Conditions

Min

Typ

Max

Units

Supply Voltage

Slew Rate 2V/ms (rising), 1V/ms (falling)

−0.5

6.0

V

Switch Voltage Range; L#, H#,

COM#

Switch Conducting/Isolating

−2.0

6.0

V

Switch Isolating

−2.0

6.0

Maximum DC Switch I/O Current

350

mA

Control Input Voltage; SEL, EN_N

−0.3

6.0

V

Junction Temperature

−40

+150

°C

Storage Temp

−65

+150

°C

Soldering Temp (10 Seconds)

+260

°C

Electrostatic Discharge Protection

Level

Human Body Model

4.0

kV

Charged Device Model

2.0

IEC 61000−4−2 System (Contact)

8

IEC 61000−4−2 System (Air Gap)

15

Latchup

Latchup Current

JEDEC Standard: JESD78

100

mA

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

Table 5. THERMAL CHARACTERISTICS

Rating

Symbol

Value

Unit

Thermal Characteristics, WLCSP−9

Thermal Resistance, Junction−to−Air (Note 1)

48

°C/W

1. JEDEC Standard, Still Air, 4−layer board with vias

Table 6. RECOMMENDED OPERATING RANGES

Symbol

Parameter

Conditions

Min

Typ

Max

Units

Supply Voltage Range

Low Supply Path Conducting

0.0

5.5

V

High Supply Path Conducting

1.65

5.5

Switch Voltage Range; L#, H#, COM#

Switch Conducting

−1.5

5.5

V

Switch Isolating

−1.5

5.5

Control Input Voltage; SEL, EN_N, NC

0.0

5.5

V

Operating Ambient Temperature

−40

+85

°C

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.