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34LC02 数据表(PDF) 35 Page - Microchip Technology |
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34LC02 数据表(HTML) 35 Page - Microchip Technology |
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35 / 40 page ![]() 2007-2022 Microchip Technology Inc. and its subsidiaries DS20002029G-page 35 34AA02/34LC02 APPENDIX A: REVISION HISTORY Revision G (04/2022) Added Automotive Product Identification System section; Fixed TBUF typo and added 1 MHz spec; Updated MSOP, PDIP, SOIC, SOT-23, TDFN and TSSOP package drawings; Replaced terminology “Master” and “Slave” with “Host” and “Client”, respectively; Reformatted some sections for better readability. Revision F (03/2011) Revised Section 3.6; Updated spec to new template. Revision E (01/2010) Revised SOT-23 and TDFN marking codes. Revision D (04/2008) Updated Product Identification System section. Revision C (02/2008) Added TDFN and SOT-23 Package info; Removed “VL” Part. Revision B (02/2007) Replaced Package Drawings. Revision A (01/2007) Initial release of this document. |
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