USB2513 datasheet(43/57 Pages) MICROCHIP

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 2022 Microchip Technology Inc. and its subsidiaries

DS00001692D-page 43

USB251xB/xBi

6.2.1

PACKAGE THERMAL SPECIFICATIONS

Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal vias in a multi-

layer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the ambient air. The values provided are

based on the package body, die size, maximum power consumption, 85°C ambient temperature, and 125°C junction

temperature of the die.

Use the following formulas to calculate the junction temperature:

TJ = P x JA + TA

TJ = P x JT + TT

TJ = P x JC + TC

Max Power Supported = (TJ Max. Spec. - TAmb.)/ JA

Symbol

USB2512B/12Bi USB2513B/13Bi

USB2514B/14Bi

(°C/W)

Velocity (meters/s)

JA

40.1

35.0

JT

0.5

0.7

JC

6.3

TABLE 6-9:

LEGEND

Symbol

Description

Junction temperature

Power dissipated

JA

Junction-to-ambient-temperature

JC

Junction-to-top-of-package

JT

Junction-to-bottom-of-case

Ambient temperature

Temperature of the bottom of the case

Temperature of the top of the case

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