USB5926CSLASHKD datasheet(61/66 Pages) MICROCHIP

部件名	USB5926C/KD

功能描述	6-Port USB 3.2 Gen 1 SmartHub with Support for Multiple USB Type-C짰 UFP and DFP

PDF	66 Pages

Scroll/Zoom	100%

制造商	MICROCHIP [Microchip Technology]

网页	http://www.microchip.com

标志

61 / 66 page

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2022 Microchip Technology Inc. and its subsidiaries

DS00003190C-page 59

USB5926C

FIGURE 11-3:

100-VQFN PACKAGE (LAND PATTERN)

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Center Pad Width

Contact Pad Spacing

Center Pad Length

Contact Pitch

8.10

MILLIMETERS

0.40 BSC

MIN

MAX

11.70

Contact Pad Length (X100)

Contact Pad Width (X100)

1.05

0.20

NOM

Contact Pad Spacing

11.70

Contact Pad to Contact Pad (X96)

0.20

Thermal Via Diameter

Thermal Via Pitch

0.33

1.20

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Contact Pad to Center Pad (X100)

1.28

Microchip Technology Drawing C04-2407-KD Rev C

SILK SCREEN

ØV Ø0.33

USB5926C/KD 数据表(PDF) 61 Page - Microchip Technology

USB5926C/KD 数据表(HTML) 61 Page - Microchip Technology

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